Having been photographed, the leaked Pixel 9, 9 Pro and 9 Pro XL have now undergone initial benchmarks, while we now have details about the Tensor G4.
According to the results of standard testing from rosetkd,Tensor G4 has a 1+3+4 core configuration with Cortex-X4 acting as the primary/pioneer. This is followed by three medium Cortex-A720 cores and four small Cortex-A520 cores.
The original Tensor and G2 had a 2+2+4 basic configuration, while the G3 went to 1+4+4. Here’s the historical comparison:
| Tensioner | Tensioner G2 | Tensioner G3 | Tensioner G4 |
| 2x Cortex-X1 (2.8GHz) | 2x Cortex-X1 (2.85GHz) | 1x Cortex-X3 (2.91GHz) | 1x Cortex-X4 (3.1GHz) |
| 2x Cortex-A76 (2.25GHz) | 2x Cortex-A78 (2.35GHz) | 4x Cortex-A715 (2.37GHz) | 3x Cortex-A720 (2.6GHz) |
| 4x Cortex-A55 (1.8GHz) | 4x Cortex-A55 (1.8GHz) | 4x Cortex-A510 (1.7GHz) | 4x Cortex-A520 (1.95GHz) |
With Cortex-X4 (which is what the Snapdragon 8 Gen 3 uses), arm pursues 15% performance improvement over the previous generation and 40% better energy efficiency.
On A720 Beforethere is a 20% increase in power efficiency compared to its predecessor, while the A510 achieves a similar gain of 22%.
These devices do not run the final software, and there are months of optimization and tuning ahead. You should take this into consideration when looking at AnTuTu benchmarks for the Tensor G4 on the Pixel 9 series. There are some performance gains, with the Pixel 8 included for comparison.
- Pixel 8: 877443 dots
- Pixel 9 (Tokai): 1,016,167
- Pixel 9 Pro (Cayman): 1,148,452
- Pixel 9 Pro XL (Comodo): 1,176,410
With the Tensor G5 on the Pixel 10 expected to switch to TSMC, the Pixel 9 and the Samsung-made chip could have a big star sign for buyers this year. Previous leaks said that the Tensor G4 will use Samsung’s latest 4nm process and packaging method. FOWLP (Fan-Out Wafer Level Packaging) is said to continue to improve heat management and power efficiency.
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